
Silicon on insulator (SOI) technology is a layered form of substrate that has silicon-insulator-silicon as its layers instead of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to improve performance. Silicon-on-insulators comprise of a thin silicon topmost layer, a thicker silicon lowermost layer, and an insulating material (such as silicon dioxide) middle layer. The silicon layer thickness differs based on the product application, which can be for electrical power switching devices or for high-performance microprocessors. SOI has been providing considerable performance gains over the past few years, both in terms speed and power, compared to corresponding bulk solutions. It not only allows better scaling, resulting in bulk solutions but also, simplifies the CMOS process, which is why it is an easy way to co-integrate different materials at the wafer level.