The global embedded die packaging technology was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. Embedded die packaging technology is a native 3D-compatible packaging solution, offering nearly 70% size reduction in system in package (SiP) solution. The advantages of this technology include miniaturization, improved electrical & thermal performance, heterogeneous integration, prospect for reduction in cost, and efficient logistics for OEM. In addition, it offers flexible system integration, fast turnaround for custom design, high robustness, and enhanced reliability of the package.